AMD is likely carrying over the client I/O die (cIOD) from the “Raphael” processor. This is built on the TSMC 6 nm DUV node. It packs a basic iGPU based on RDNA 2 with 2 compute units; a dual-channel DDR5 memory controller, and a 28-lane PCIe Gen 5 root complex, besides some SoC connectivity. AMD is rumored to be increasing the native DDR5 speeds for “Granite Ridge,” up from the DDR5-5200 JEDEC-standard native speed, and DDR5-6000 “sweetspot” speed of “Raphael,” so the cIOD isn’t entirely the same.
Each “Zen 5” CCD is confirmed to contain no more than 8 CPU cores, and the “Granite Ridge” processor has a maximum of 2 CCDs, which means the CPU core counts is unchanged generationally—you have 16-core, 12-core, 8-core, and 6-core SKUs, spanning the Ryzen 9, Ryzen 7, and Ryzen 5 brand extensions. The slide also confirms the first four SKUs AMD is planning to launch—the Ryzen 9 9950X is on the top, likely a 16-core/32-thread chip. This is followed by the Ryzen 9 9900X, a 12-core/24-thread chip. After this, is the Ryzen 7 9700X, an 8-core/16-thread chip, and lastly, there’s the Ryzen 5 9600 (non-X), a 6-core/12-thread chip. TDP ranges between 65 W for the 9600, to 170 W for the top Ryzen 9 chips, just like on the Ryzen 7000 series.